BACKPLANE
X-Ray
including AOI
The only robotic testers designed specifically for backplanes
RoBAT RXI
Colour Automatic Optical Inspection and High Resolution Automatic X-ray Inspection in one machine.
Other Products
- BACKPLANE Fixtureless Test
including AOI - BACKPLANE Bed-of-nails Fixtures
for any machine - BACKPLANE Fixtured Test
including ICT - BACKPLANE
Signal Integrity
TDR, S-parameter
Key Features
- Combined AOI + X-ray in one machine – automatically distinguishes between bent pins above and below a connector shell.
- Press fit connector faults – Bent under compliant pins, crushed pins, missing pins on connectors including Zipline and Xcede complexity.
- Bent pin detection – Optical mating pin tip position detection down to <100μm positional error.
- Component inspection –Missing component, component orientation, component value, and damaged component detection.
- Solder joint inspection – Solder profile, solder area and void area detection on SMT components down to 0201, dual-in-line packages down to VSOP, quad-in-line down to lead less QFN and MLP.
- Tests Double-sided boards – standard 1.4m x 700mm (up to 1.6m x 1m) - typical test times are 3 – 10 minutes
- Full robotic control of X-ray source and Camera position – allows features to be imaged at multiple angles.
- 3D imaging for detailed fault analysis.
- Fast programming – common suite to other RoBAT products.
- Detailed fault printout – to pass to repair person